Intel(R) Core(TM) i5-4260U CPU @ 1.40GHz (4 CPUs), ~2.0GHz_笔记本吧_百度贴吧
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Intel(R) Core(TM) i5-4260U CPU @ 1.40GHz (4 CPUs), ~2.0GHz收藏
这个处理器怎么样
搭载第七代英特尔酷睿i5.英特尔,让性能更超凡 登陆惠普电脑京东旗舰店购买.多彩外观,强劲性能,超高性价比,惠普Pavilion系列笔记本,返校必备,赢在开学时!
相当于i3标压
发一下具体配置，CPU，独显，内存，硬盘。
------------------System Information------------------Time of this report: 7/28/:02
Machine name: APPLE-PC
Operating System: Windows 7 家庭普通版 64-bit (6.1, Build 7601) Service Pack 1 (7601.win7sp1_rtm.0)
Language: Chinese (Simplified) (Regional Setting: Chinese (Simplified))System Manufacturer: Apple Inc.
System Model: MacBookAir6,2
BIOS: Default System BIOS
Processor: Intel(R) Core(TM) i5-4260U CPU @ 1.40GHz (4 CPUs), ~2.0GHz
Memory: 4096MB RAMAvailable OS Memory: 4036MB RAM
Page File: 1440MB used, 6630MB available
Windows Dir: C:\Windows
DirectX Version: DirectX 11DX Setup Parameters: Not found
User DPI Setting: Using System DPI System DPI Setting: 96 DPI (100 percent)
DWM DPI Scaling: Disabled
DxDiag Version: 6.01. 32bit Unicode------------DxDiag Notes------------
Display Tab 1: No problems found.
Sound Tab 1: No problems found.
Input Tab: No problems found.--------------------DirectX Debug Levels--------------------Direct3D:
0/4 (retail)DirectDraw:
0/4 (retail)DirectInput: 0/5 (retail)DirectMusic: 0/5 (retail)DirectPlay:
0/9 (retail)DirectSound: 0/5 (retail)DirectShow:
0/6 (retail)---------------Display Devices---------------
Card name: Intel(R) HD Graphics 5000
Manufacturer: Intel Corporation
Chip type: Intel(R) HD Graphics Family
DAC type: Internal
Device Key: Enum\PCI\VEN_8086&DEV_0A26&SUBSYS_011B106B&REV_09
Display Memory: 1696 MB
Dedicated Memory: 64 MB
Shared Memory: 1632 MB
Current Mode: 1440 x 900 (32 bit) (60Hz)
Monitor Name: 通用即插即用监视器
Monitor Model: Color LCD
Monitor Id: APP9CDF
Native Mode: 1440 x 900(p) (59.840Hz)
Output Type: Internal
Driver Name: igdumdim64.dll,igd10iumd64.dll,igd10iumd64.dll,igdumdim32,igd10iumd32,igd10iumd32Driver File Version: 9.18. (English)
Driver Version: 9.18.10.3131
DDI Version: 11
Driver Model: WDDM 1.1
Driver Attributes: Final Retail
Driver Date/Size: 5/4/:16, 8866816 bytes
WHQL Logo*d: Yes
WHQL Date Stamp:
Device Identifier: {D7B78E66-4966-11CF-E07F-C435}
Vendor ID: 0x8086
Device ID: 0x0A26
SubSys ID: 0x011B106B
Revision ID: 0x0009 Driver Strong Name: oem4.inf:Intel.Mfg.NTamd64:iHSWM0:9.18.10.3131:pci\ven_8086&dev_0a26
Rank Of Driver: 00E02001
Video Accel: ModeMPEG2_A ModeMPEG2_C ModeWMV9_C ModeVC1_C
Deinterlace Caps: {BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(YUY2,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(YUY2,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(YUY2,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(UYVY,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(UYVY,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(UYVY,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(YV12,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(YV12,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(YV12,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(NV12,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(NV12,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(NV12,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(IMC1,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(IMC1,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(IMC1,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(IMC2,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(IMC2,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(IMC2,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(IMC3,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(IMC3,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(IMC3,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
{BF752EF6-8CC4-457A-BE1B-08BD1CAEEE9F}: Format(In/Out)=(IMC4,YUY2) Frames(Prev/Fwd/Back)=(0,0,1) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_EdgeFiltering
{335AA36E--9C91-7F87FAF3E37E}: Format(In/Out)=(IMC4,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend DeinterlaceTech_BOBVerticalStretch
{5A54A0C9-C7EC-4BD9-8EDE-F3C75DC4393B}: Format(In/Out)=(IMC4,YUY2) Frames(Prev/Fwd/Back)=(0,0,0) Caps=VideoProcess_YUV2RGB VideoProcess_StretchX VideoProcess_StretchY VideoProcess_AlphaBlend
D3D9 Overlay: Supported
DXVA-HD: Supported
DDraw Status: Enabled
D3D Status: Enabled
AGP Status: Enabled
就是低配版的Mac,这个价格，lz想玩游戏的话还是选择其他的吧，比较果粉是一种信仰。。。
楼主买Terrans force吧　　　--去见你想见的人吧！趁阳光正好，趁微风不噪，趁你还年轻，趁他还未老。
呃呵，还行。
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为兴趣而生，贴吧更懂你。或四核的Intel,Core,i5,（2.7GHz）和四核的,i7（2.8GHz）在性能上到底有多大差距,值不值1000多的差价,
四核的Intel Core i5 (2.7GHz)和四核的 i7(2.8GHz)在性能上到底有多大差
来源：网络
关键字： 2.7ghz i7
更新时间：
延伸：本文除了聚合《四核的Intel,Core,i5,（2.7GHz）和四核的,i7（2.8GHz）在性能上到底有多大差距,值不值1000多的差价,》，免费提供的有关2.7ghz i7和四核的Intel Core i5 (2.7GHz)和四核的 i7(2.8GHz)在性能上到底有多大差的内容之一，已有不少的网友认为此答案对自己有帮助！
网友1的回答
四核的Intel Core i5 (2.7GHz)和四核的 i7(2.8GHz)在性能上到底有多大差网友2的回答
同样都是四核,I7比I5还要强30%以上,你用双核I5斗四核I7,更是被秒得找不到北,你说的2.6G网友3的回答
差别很大,I7双核笔记本处理器为低压版处理器,性能较低,而I7四核笔记本处理器为标准版、高压版处理器网友4的回答
差不了多少 1300明显是坑爹 不过苹果本来不就是坑爹的吗= = 买得起苹果的 不差这钱儿 估计人家网友5的回答
2.9GHz的i5 秒杀I7 2.3,主频相差太大,对整体性能影响很大,特别是内存性能,没有个3G频网友6的回答
酷睿I7和酷睿I5是产品定位品牌,参数不是恒定的。I5就是要比I7差,不解释 一、主频分段划分情况。网友7的回答
看你做什么用,做设计的话,3DMAX渲染的话,大型设计软件,效果会突出!!但如果你普通使用,多开几个网友8的回答
三者区别大致如下。 价格区别:i3价格稍低,i5价格居中,i7价格高; 性能区别:i3的性能比i5稍网友9的回答
)换成Intel Core i7-2630QM(2.0GHz)值不值?Intel的睿频技术实际网友10的回答
网友7的回答
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相关关键词欢迎来到慢慢买！ &
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慢慢买客户端
英特尔(Intel)i5-6400 四核Skylake架构(LGAGHz/6M）
价格区间：￥1269至￥1445
优选评价：4.8分
全网共有 8206 人评论 &
& 类目排名第
品牌：上市时间：2015年09月CPU系列：酷睿i5CPU主频：2.4GHz-2.8GHz核心数：四核心接口类型：其他接口
Intel i5-6400怎么样？看看下面购买过的网友怎么说！
796人参与评分
购买过此商品？
购买自【】
买的时候跟6500相差130块，默频相差0.5，看起来很大，但实际使用起来，睿频相差0.2-0.3的频率，相同的配置情况下，你几乎感觉不出来，顾及不到10%的性能。如果有强迫症的就加130左右上6500。让我后悔的是没上6402P，虽然核显差了点，但是如果要上独显的话无关要紧了，价格要少了60。
购买自【】
英特尔中文盒装处理器，性价比好，散热好，值得拥有
购买自【】
最低￥1429 最低￥458 最低￥818 最低￥2465 最低￥1579 最低￥774 最低￥789 最低￥2195 最低￥2799 最低￥697 最低￥415 最低￥249
购买过Intel i5-6400吗？快来说说Intel i5-6400怎么样，给更多网友参考吧！
千万不要买
&1269&1309&1339&1439&1445
CPU口碑排行
最低价：￥458
最低价：￥1429
最低价：￥2465
最低价：￥1579
最低价：￥774
CPU购买知识
扫描下载慢慢买APP
全网比价 省钱专家Intel® Core(TM) i5-5250U Processor (3M Cache, up to 2.70 GHz) Product Specifications
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Specifications
Product Collection
Vertical Segment
Processor Number
5 GT/s DMI2
600.00 MHz
DDR3L , LPDDR3
Intel(R) HD Graphics 6000
300.00 MHz
950.00 MHz
eDP/DP/HDMI
# of Displays Supported ?
Max CPU Configuration
Package Size
40mm x24mm x 1.3mm
Low Halogen Options Available
SSE4.1/4.2, AVX 2.0
Ordering and Compliance
ECCN5A992CN3
CCATSG071701++
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.
The information herein is provided &as-is& and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
Please contact system vendor for more information on specific products or systems.
&Intel classifications& consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M.
Please contact OEM for the BIOS that includes the latest Processor configuration update.
? This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries.
Intel processors manufactured before January 1, 2013 are not confirmed conflict free.
The conflict free designation refers only to product manufactured after that date.
For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
for more information including details on which processors support Intel(R) HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel(R) Turbo Boost Technology.
for more information.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products.
Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP
does not constitute a formal pricing offer from Intel.
Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios.
Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen:
Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product.
Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC
requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see .
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
for details.
Processors that support 64-bit computing on Intel(R) architecture require an Intel 64 architecture-enabled BIOS.
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Recommended Customer Price
Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close.
The processor base frequency is the operating point where TDP is defined.
Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel(R) Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor.
Intel(R) Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and m direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’ and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-down Frequency
Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Frequency is where the Configurable TDP-down is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report.
See your Intel representative for details.
Conflict Free
“Conflict free”
means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel(R) processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s)
Processor Graphics ?
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel(R) HD Graphics, Iris(TM) Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the
page for more information.
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel(R) HD Graphics with Dynamic Frequency feature
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Max Resolution (HDMI 1.4)?
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple s actual resolution may be lower on your system.
Max Resolution (DP)?
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple s actual resolution may be lower on your system.
DirectX* Support
DirectX indicates support for a specific version of Microsoft’s collection of API’s (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Intel(R) Quick Sync Video
Intel(R) Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel(R) InTru(TM) 3D Technology
Intel(R) InTru(TM) 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.
Intel(R) Flexible Display Interface (Intel(R) FDI)
The Intel(R) Flexible Display Interface is an innovative path for two independently controlled channels of integrated graphics to be displayed.
Intel(R) Clear Video HD Technology
Intel(R) Clear Video HD Technology, like its predecessor, Intel(R) Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel(R) Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
Intel(R) Clear Video Technology
Intel(R) Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.
PCI Express Revision
PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer.
The different PCI Express versions support
different data rates.
PCI Express Configurations ?
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Junction Temperature is the maximum
temperature allowed at the processor die.
Intel(R) Turbo Boost Technology ?
Intel(R) Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel(R) vPro Technology ?
Intel(R) vPro(TM) Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security:
1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel(R) Hyper-Threading Technology ?
Intel(R) Hyper-Threading Technology (Intel(R) HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel(R) Virtualization Technology (VT-x) ?
Intel(R) Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel(R) Virtualization Technology for Directed I/O (VT-d) ?
Intel(R) Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium(R) processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel(R) VT-x with Extended Page Tables (EPT) ?
Intel(R) VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel(R) Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel(R) TSX-NI
Intel(R) Transactional Synchronization Extensions New Instructions (Intel(R) TSX-NI) are a set of instructions focused on multi-threaded performance scaling.
This technology helps make parallel operations more efficient via improved control of locks in software.
Intel(R) 64 ?
Intel(R) 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.? Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects.
These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle.
C0 is the operational state, meaning that the CPU is doing useful work.
C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep(R) Technology
Enhanced Intel SpeedStep(R) Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep(R) Technology switches both voltage and frequency in tandem between high and low levels in response to processor load.
Enhanced Intel SpeedStep(R) Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features.
An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits
Intel(R) Fast Memory Access
Intel(R) Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel(R) Flex Memory Access
Intel(R) Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Intel(R) Identity Protection Technology ?
Intel(R) Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud.
Intel(R) IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions,
providing verification that it is not malware attempting to login.
Intel(R) IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel(R) Stable Image Platform Program (SIPP)
Intel(R) Stable Image Platform Program (Intel(R) SIPP) can help your company identify and deploy standardized, stable image PC platforms for at least 15 months
Intel(R) Smart Response Technology
Intel(R) Smart Response Technology combines the fast performance of a small solid state drive with the large capacity of a hard disk drive
Intel(R) AES New Instructions
Intel(R) AES New Instructions (Intel(R) AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Secure Key
Intel(R) Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
Trusted Execution Technology ?
Intel(R) Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel(R) processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ?
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
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